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TDZ5V1J,115 - Nexperia

Description: Single Zener diodes

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PCB Footprints
TDZ5V1J,115 - Nexperia PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD323F (SC-90)-2
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3D Models
TDZ5V1J,115 - Nexperia  - 3D model - Small Outline Diode Flat Lead - SOD323F (SC-90)-2
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TDZ5V1J,115 Details

  • Manufacturer Part Number:

    TDZ5V1J,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOD

  • Package Description:

    SC-90, SOD-323F, 2 PIN

  • Pin Count:

    2

  • Manufacturer Package Code:

    SOD323F

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2017-02-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    60 Ω

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Knee Impedance-Max:

    480 Ω

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.5 W

  • Reference Standard:

    IEC-60134

  • Reference Voltage-Nom:

    5.1 V

  • Reverse Current-Max:

    3 µA

  • Reverse Test Voltage:

    2 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Voltage Temp Coeff-Max:

    -0.8 mV/°C

  • Voltage Tol-Max:

    1.96%

  • Working Test Current:

    5 mA

TDZ5V1J,115 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for TDZ5V1J,115 is a standard SOT23 package with a minimum pad size of 0.8 mm x 0.8 mm and a thermal pad size of 2.5 mm x 2.5 mm.
  • To ensure reliability in high-temperature applications, it is recommended to follow Nexperia's guidelines for thermal design and layout, and to consider using a heat sink or thermal interface material to reduce the junction temperature.
  • Yes, TDZ5V1J,115 can be used in switching regulator applications, but it is recommended to ensure that the device is operated within its safe operating area (SOA) and that the switching frequency is within the recommended range.
  • The power dissipation of TDZ5V1J,115 can be calculated using the formula Pd = (Vds x Ids) + (Vgs x Igs), where Vds is the drain-source voltage, Ids is the drain-source current, Vgs is the gate-source voltage, and Igs is the gate-source current.
  • Yes, TDZ5V1J,115 is compatible with lead-free soldering processes, and Nexperia recommends following the IPC J-STD-020 standard for lead-free soldering.

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TDZ5V1J,115 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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