TEA1062A - NXP

TEA1062A Details

• Manufacturer Part Number:

  TEA1062A

• Pbfree Code:

  Yes

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active Unconfirmed

• Part Package Code:

  DIP

• Package Description:

  0.300 INCH, PLASTIC, SOT-38, DIP-16

• Pin Count:

  16

• HTS Code:

  8542.39.00.01

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  2

• JESD-30 Code:

  R-PDIP-T16

• Length:

  21.6 mm

• Number of Functions:

  1

• Number of Terminals:

  16

• Operating Temperature-Max:

  75 °C

• Operating Temperature-Min:

  -25 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  DIP

• Package Equivalence Code:

  DIP16,.3

• Package Shape:

  RECTANGULAR

• Package Style:

  IN-LINE

• Peak Reflow Temperature (Cel):

  245

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  4.7 mm

• Supply Current-Max:

  1.35 mA

• Supply Voltage-Nom:

  3.4 V

• Surface Mount:

  NO

• Technology:

  BIPOLAR

• Telecom IC Type:

  TELEPHONE SPEECH CIRCUIT

• Temperature Grade:

  COMMERCIAL EXTENDED

• Terminal Form:

  THROUGH-HOLE

• Terminal Pitch:

  2.54 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  7.62 mm