TEA1062AT - NXP

TEA1062AT Details

• Manufacturer Part Number:

  TEA1062AT

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  SOIC

• Package Description:

  PLASTIC, SOT-109, SO-16

• Pin Count:

  16

• HTS Code:

  8542.39.00.01

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• JESD-30 Code:

  R-PDSO-G16

• Length:

  9.9 mm

• Number of Functions:

  1

• Number of Terminals:

  16

• Operating Temperature-Max:

  75 °C

• Operating Temperature-Min:

  -25 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  SOP

• Package Equivalence Code:

  SOP16,.25

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.75 mm

• Supply Current-Max:

  1.35 mA

• Supply Voltage-Nom:

  3.4 V

• Surface Mount:

  YES

• Technology:

  BIPOLAR

• Telecom IC Type:

  TELEPHONE SPEECH CIRCUIT

• Temperature Grade:

  COMMERCIAL EXTENDED

• Terminal Form:

  GULL WING

• Terminal Pitch:

  1.27 mm

• Terminal Position:

  DUAL

• Width:

  3.9 mm