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TEA1716T/2,518 - NXP

Description: Integrated PFC and HBC controllers  Universal mains supply operation from 70 V to 276 V (AC)  High level of integration resulting in a low external component count and a cost effective design  Integrated Burst mode sensing  Compliant with Energy Using Product Directive (EuP) lot 6  Enable input to enable only the PFC or both the PFC and HBC controllers  On-chip high-voltage start-up source  Stand-alone operation or IC supplied from external DC source

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TEA1716T/2,518 - NXP - PCB symbol
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PCB Footprints
TEA1716T/2,518 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SO24
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TEA1716T/2,518 - NXP - 3D model - Small Outline Packages - SO24
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TEA1716T/2,518 Details

  • Manufacturer Part Number:

    TEA1716T/2,518

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOP

  • Package Description:

    SOP-24

  • Pin Count:

    24

  • Manufacturer Package Code:

    SOT137-1

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    7

  • Analog IC - Other Type:

    POWER FACTOR CONTROLLER WITH POST REGULATOR

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    RESONANT CONTROL

  • Input Voltage-Max:

    15.9 V

  • Input Voltage-Min:

    14.1 V

  • Input Voltage-Nom:

    15 V

  • JESD-30 Code:

    R-PDSO-G24

  • JESD-609 Code:

    e4

  • Length:

    15.4 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP24,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Nom (Vsup):

    20 V

  • Surface Mount:

    YES

  • Switcher Configuration:

    BOOST

  • Switching Frequency-Max:

    500 kHz

  • Technology:

    BCDMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

TEA1716T/2,518 Frequently Asked Questions (FAQs)

  • A good PCB layout is crucial for the TEA1716T. Ensure a solid ground plane, keep sensitive analog signals away from digital signals, and use a star-configuration for the power supply. Refer to the NXP application note AN11535 for more details.
  • The output filter design depends on the specific application requirements. Use the NXP Filter Design Tool or consult the TEA1716T datasheet for guidance on selecting the right components. Consider factors like output voltage, current, and ripple requirements.
  • The TEA1716T has a thermal pad that must be connected to a solid ground plane for heat dissipation. Ensure good airflow, and consider using a heat sink if the device will be operating at high temperatures or high currents.
  • Check the PCB layout, ensure proper decoupling, and verify the input and output voltage levels. Use an oscilloscope to analyze the waveforms and identify any anomalies. Consult the NXP support resources or application notes for troubleshooting guides.
  • Yes, the TEA1716T is qualified for automotive and high-reliability applications. However, ensure that you follow the recommended design guidelines, and consult the NXP documentation for specific requirements and certifications (e.g., AEC-Q100).

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TEA1716T/2,518 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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