TEA1721AT/N1,118 footprint, schematic symbol and 3D model by NXP

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PCB Footprints

TEA1721AT/N1,118 - NXP PCB footprint - Other - Other - SOT1175-1 (SO7)

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Datasheet Download Datasheet
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Part Number TEA1721AT/N1,118
Manufacturer NXP
Pin Count 7
Part Category Integrated Circuit
Package Category Other
Footprint Name Other - SOT1175-1 (SO7)
Released Date Nov 8, 2019
Last Modified Date Jan 21, 2025 10:58 AM UTC
Pinout / Pin List Click Here (Member Only)

TEA1721AT/N1,118 Details

Manufacturer Part Number:
TEA1721AT/N1,118
Source Url Status Check Date:
2013-06-14 00:00:00
Brand Name:
NXP Semiconductor
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
SOP
Package Description:
SOP-7
Pin Count:
7
Manufacturer Package Code:
SOT1175-1
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8542.39.00.01
Factory Lead Time:
21 Weeks
Manufacturer:
NXP Semiconductors
YTEOL:
6.3
Analog IC - Other Type:
SWITCHING CONTROLLER
Control Mode:
VOLTAGE-MODE
Input Voltage-Nom:
20 V
JESD-30 Code:
R-PDSO-G7
JESD-609 Code:
e4
Length:
4.9 mm
Moisture Sensitivity Level:
1
Number of Functions:
1
Number of Terminals:
7
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
SOP
Package Equivalence Code:
SOP7/8,.25
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1.75 mm
Supply Current-Max (Isup):
0.97 mA
Surface Mount:
YES
Switching Frequency-Max:
50.5 kHz
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form:
GULL WING
Terminal Pitch:
1.27 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Width:
3.9 mm

TEA1721AT/N1,118 Frequently Asked Questions (FAQs)

A good PCB layout is crucial for the TEA1721AT/N1,118. NXP recommends a 4-layer PCB with a solid ground plane, and to keep the input and output tracks as short as possible. Additionally, it's essential to follow the layout guidelines provided in the application note AN11542.
The TEA1721AT/N1,118 can generate significant heat during operation. To ensure proper cooling, NXP recommends a heat sink with a thermal resistance of less than 10°C/W. Additionally, ensure good airflow around the device, and consider using a thermal interface material to improve heat transfer.
The maximum allowed voltage on the VIN pin is 30V, but it's recommended to keep it below 28V to ensure reliable operation and to prevent damage to the device.
The TEA1721AT/N1,118 can be configured for a specific output voltage by adjusting the resistive divider network on the FB pin. The output voltage can be calculated using the formula: Vout = 1.25V x (R1 + R2) / R2. Consult the datasheet for more information.
The EN (enable) pin is used to enable or disable the TEA1721AT/N1,118. When the EN pin is high, the device is enabled, and when it's low, the device is disabled. This pin can be used to implement power sequencing or to shut down the device when not in use.

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TEA1721AT/N1,118 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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