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TEA1751LT/N1,518 - NXP

Description: NXP TEA1751LT/N1,518, DC-DC Controller, 16-Pin, SOIC

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PCB Footprints
TEA1751LT/N1,518 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SO16(Thickness=1.75mm)
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TEA1751LT/N1,518 - NXP  - 3D model - Small Outline Packages - SO16(Thickness=1.75mm)
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TEA1751LT/N1,518 Details

  • Manufacturer Part Number:

    TEA1751LT/N1,518

  • Source Url Status Check Date:

    2013-06-14 00:00:00

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOP

  • Package Description:

    3.90 MM, PLASTIC, MS-012, SOT-109-1, SOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    SOT109-1

  • Country Of Origin:

    Mainland China, Taiwan, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    7

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    650 V

  • Input Voltage-Min:

    9 V

  • Input Voltage-Nom:

    20 V

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Nom:

    2.5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    3.75 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    SINGLE

  • Switching Frequency-Max:

    150 kHz

  • Technology:

    BCDMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TEA1751LT/N1,518 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the TEA1751LT/N1,518 near a thermal pad or a heat sink, ensuring good thermal conductivity. Keep the component away from high-frequency signals and avoid routing high-current traces underneath the IC.
  • To ensure reliable start-up and shutdown, ensure a soft-start circuit is implemented to limit the inrush current. Also, add a delay between the enable signal and the input voltage to prevent unwanted start-ups.
  • When designing an EMI filter, consider the input capacitor, output capacitor, and the inductor values. Ensure the filter is optimized for the specific application's frequency range and meets the required attenuation levels.
  • Optimize the feedback network by selecting the right compensation components (R and C) to achieve a stable loop gain and phase margin. Use simulation tools or SPICE models to fine-tune the design.
  • When selecting a heat sink, consider the thermal resistance, material, and surface finish. Ensure the heat sink is compatible with the TEA1751LT/N1,518's thermal pad and that the thermal interface material is suitable for the application.

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TEA1751LT/N1,518 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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