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TEA1755T/1,518 - NXP

Description: AC/DC Converters HV start-up DCM/QR flyback controller with integrated DCM/QR PFC controller

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TEA1755T/1,518 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SOT109-1 (SO16)
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TEA1755T/1,518 - NXP  - 3D model - Small Outline Packages - SOT109-1 (SO16)
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TEA1755T/1,518 Details

  • Manufacturer Part Number:

    TEA1755T/1,518

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOP

  • Package Description:

    SOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    SOT109-1

  • Similar Group:

    SM00100110011088

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    21 Weeks

  • Manufacturer:

    NXP Semiconductors

  • Additional Feature:

    ALSO HAS A CONTROL TECHNIQUE OF ZVS and ZCS

  • Analog IC - Other Type:

    POWER FACTOR CONTROLLER WITH POST REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    RESONANT CONTROL

  • Input Voltage-Nom:

    20 V

  • JESD-30 Code:

    R-PDSO-G16

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, 13 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    2.15 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Switching Frequency-Max:

    159 kHz

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

TEA1755T/1,518 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Implement a soft-start circuit to limit inrush current during start-up. For shutdown, ensure a controlled shutdown sequence to prevent voltage spikes and ensure all internal circuits are fully discharged.
  • Use a combination of X-capacitors, Y-capacitors, and common-mode chokes to filter out electromagnetic interference (EMI). Additionally, consider adding a noise filter capacitor (e.g., 10nF) between the input and output stages.
  • Choose a suitable feedback resistor (Rfb) value based on the output voltage and current requirements. Ensure the feedback loop is properly compensated using a capacitor (Cfb) and resistor (Rfb) in series.
  • Use a heat sink with a thermal resistance of <1°C/W. Ensure good thermal contact between the device and heat sink using a thermal interface material (TIM). Keep the heat sink away from other components to prevent thermal coupling.

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TEA1755T/1,518 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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