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TEA1792ATS/1Z - NXP

Description: Power Management Specialized - PMIC Synchronous rectification controller suitable for both high-side and low-side control

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PCB Footprints
TEA1792ATS/1Z - NXP PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT457
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3D Models
TEA1792ATS/1Z - NXP  - 3D model - SOT23 (6-Pin) - SOT457
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TEA1792ATS/1Z Details

  • Manufacturer Part Number:

    TEA1792ATS/1Z

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSOP-6

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    NXP Semiconductors

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Technique:

    RESONANT CONTROL

  • Input Voltage-Max:

    38 V

  • Input Voltage-Min:

    8.5 V

  • Input Voltage-Nom:

    20 V

  • JESD-30 Code:

    R-PDSO-G6

  • Length:

    2.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSOP6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    1.2 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK-BOOST

  • Technology:

    SOI-CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.5 mm

TEA1792ATS/1Z Frequently Asked Questions (FAQs)

  • A good PCB layout for the TEA1792ATS/1Z involves keeping the high-frequency switching nodes (e.g., SW node) away from sensitive analog nodes, using a solid ground plane, and minimizing loop areas in the power stage. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To optimize the compensation network, start with the recommended values in the datasheet and then adjust RCOMP and CCOMP based on the specific application requirements. Use a network analyzer or a Bode plot to measure the loop gain and adjust the compensation network to achieve a stable and optimal response.
  • The maximum allowed voltage on the VCC pin of the TEA1792ATS/1Z is 5.5V. Exceeding this voltage may damage the device.
  • To ensure proper synchronization, connect the external clock source to the SYNC pin and set the SYNC_SEL pin to the correct logic level (high or low) according to the datasheet. Also, ensure the clock frequency is within the recommended range (typically 100 kHz to 500 kHz).
  • A good thermal design for the TEA1792ATS/1Z involves using a heat sink with a thermal resistance of less than 10°C/W, ensuring good airflow, and keeping the device away from other heat sources. The maximum junction temperature (Tj) should not exceed 150°C.

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TEA1792ATS/1Z Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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