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TFM201208BLD-R33MTCA - TDK

Description: SMD / SMT Inductors (Coils), L=0.33?H, L x W x T :

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PCB Footprints
TFM201208BLD-R33MTCA - TDK PCB footprint - Inductors Chip - Inductors Chip - TFM2012
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3D Models
TFM201208BLD-R33MTCA - TDK  - 3D model - Inductors Chip - TFM2012
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TFM201208BLD-R33MTCA Details

  • Manufacturer Part Number:

    TFM201208BLD-R33MTCA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.4

  • Case/Size Code:

    0805

  • Construction:

    Rectangular

  • Core Material:

    METAL CORE

  • DC Resistance:

    0.032 Ω

  • Inductance-Nom (L):

    0.33 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    0.8 mm

  • Package Length:

    2 mm

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, Embossed Plastic, 7 Inch

  • Rated Current-Max:

    4 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

TFM201208BLD-R33MTCA Frequently Asked Questions (FAQs)

  • The recommended land pattern for TFM201208BLD-R33MTCA can be found in the TDK Corporation's application note or footprint recommendation document, which provides detailed information on the recommended pad layout, size, and spacing for optimal performance and reliability.
  • Thermal management is critical for the reliability and performance of TFM201208BLD-R33MTCA. It is recommended to use a thermal pad or heat sink to dissipate heat, and to ensure good airflow around the component. The thermal resistance of the component should also be considered in the design.
  • The maximum operating temperature range for TFM201208BLD-R33MTCA is typically specified in the datasheet, but it's essential to note that the component may have different temperature ratings for storage, operation, and reflow soldering. It's crucial to check the datasheet and consult with TDK Corporation's application engineers if necessary.
  • TFM201208BLD-R33MTCA is designed to meet the requirements of various industries, including automotive and industrial applications. However, it's essential to evaluate the component's vibration resistance and ensure that it meets the specific requirements of your application. Consult with TDK Corporation's application engineers or refer to the component's reliability report for more information.
  • To ensure the reliability of TFM201208BLD-R33MTCA in a humid environment, it's recommended to follow proper storage and handling procedures, such as storing the components in a dry, cool place, and using moisture-resistant packaging. Additionally, consider using conformal coating or potting to protect the component from moisture ingress.

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TFM201208BLD-R33MTCA Overview

Use the download button to access the TFM201208BLD-R33MTCA schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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