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TFM252012ALMAR22MTAA - TDK

Description: TDK - TFM252012ALMAR22MTAA - High Frequency Inductor, 220 nH, TFM-ALMA series, 8.5 A, 1008 [2520 Metric], Thin Film, 0.013 ohm

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PCB Footprints
TFM252012ALMAR22MTAA - TDK PCB footprint - Inductors Chip - Inductors Chip - TFM252012ALMA
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3D Models
TFM252012ALMAR22MTAA - TDK  - 3D model - Inductors Chip - TFM252012ALMA
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TFM252012ALMAR22MTAA Details

  • Manufacturer Part Number:

    TFM252012ALMAR22MTAA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.4

  • Case/Size Code:

    1008

  • Construction:

    Rectangular

  • Core Material:

    Metal

  • DC Resistance:

    0.013 Ω

  • Inductance-Nom (L):

    0.22 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.2 mm

  • Package Length:

    2.5 mm

  • Package Style:

    SMT

  • Package Width:

    2 mm

  • Packing Method:

    TR, Embossed Plastic, 7 Inch

  • Rated Current-Max:

    6.7 A

  • Reference Standard:

    AEC-Q200

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

TFM252012ALMAR22MTAA Frequently Asked Questions (FAQs)

  • The recommended land pattern for TFM252012ALMAR22MTAA can be found in the TDK Corporation's application note or the IPC-7351 standard. It's essential to follow the recommended land pattern to ensure reliable soldering and to prevent thermal and mechanical stress.
  • To ensure proper thermal management, it's recommended to provide a thermal pad on the PCB, and to use a thermal interface material (TIM) between the component and the heat sink. The thermal pad should be designed to dissipate heat efficiently, and the TIM should have a high thermal conductivity.
  • The maximum operating temperature range for TFM252012ALMAR22MTAA is -40°C to 125°C. However, it's essential to note that the component's performance and reliability may degrade if operated at the extreme temperatures for an extended period.
  • Yes, TFM252012ALMAR22MTAA is designed to withstand high-vibration environments. However, it's essential to ensure that the component is properly mounted and secured to the PCB to prevent mechanical stress and damage.
  • The recommended storage condition for TFM252012ALMAR22MTAA is in a dry, cool place, away from direct sunlight and moisture. The storage temperature should be between -10°C to 30°C, and the humidity should be below 60%.

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TFM252012ALMAR22MTAA Overview

Use the download button to access the TFM252012ALMAR22MTAA schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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