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TFM252012ALMAR33MTAA - TDK

Description: SMD / SMT Inductors (Coils), L=0.33?H, L x W x T :

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TFM252012ALMAR33MTAA - TDK PCB footprint - Inductors Chip - Inductors Chip - TFM252012ALMAR33MTAA-1
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3D Models
TFM252012ALMAR33MTAA - TDK  - 3D model - Inductors Chip - TFM252012ALMAR33MTAA-1
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TFM252012ALMAR33MTAA Details

  • Manufacturer Part Number:

    TFM252012ALMAR33MTAA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.4

  • Case/Size Code:

    1008

  • Construction:

    Rectangular

  • Core Material:

    Metal

  • DC Resistance:

    0.018 Ω

  • Inductance-Nom (L):

    0.33 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.2 mm

  • Package Length:

    2.5 mm

  • Package Style:

    SMT

  • Package Width:

    2 mm

  • Packing Method:

    TR, Embossed Plastic, 7 Inch

  • Rated Current-Max:

    5.7 A

  • Reference Standard:

    AEC-Q200

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

TFM252012ALMAR33MTAA Frequently Asked Questions (FAQs)

  • The recommended land pattern for the TFM252012ALMAR33MTAA can be found in the TDK Corporation's application note or in the IPC-7351 standard. It's essential to follow the recommended land pattern to ensure reliable soldering and to prevent thermal issues.
  • To prevent damage, it's recommended to handle the component by the edges, avoid touching the pads or the component body, and use an anti-static wrist strap or mat to prevent electrostatic discharge. Additionally, follow the recommended storage and handling procedures outlined in the datasheet.
  • The thermal resistance of the TFM252012ALMAR33MTAA is typically specified in the datasheet. It's essential to consider the thermal resistance in the design to ensure that the component operates within its recommended temperature range. This may involve thermal simulations, thermal interface material selection, and heat sink design.
  • The TFM252012ALMAR33MTAA is designed to meet certain vibration and shock standards, but it's essential to review the datasheet and application notes to ensure that the component can withstand the specific environmental conditions of your application. You may need to consider additional mechanical support or potting compounds to ensure reliability.
  • To troubleshoot issues with the TFM252012ALMAR33MTAA, start by reviewing the application notes and datasheet to ensure that the component is used within its recommended operating conditions. Check for proper soldering, thermal management, and electrical connections. Use diagnostic tools such as thermal imaging cameras, oscilloscopes, or logic analyzers to identify the root cause of the issue.

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TFM252012ALMAR33MTAA Overview

Use the download button to access the TFM252012ALMAR33MTAA schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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