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TFM322512ALMAR10MTAA - TDK

Description: Inductors for Power Circuits, Automotive, Thin Film Metal, TFM322512ALMA ,-55 to +150

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PCB Footprints
TFM322512ALMAR10MTAA - TDK PCB footprint - Inductors Chip - Inductors Chip - LxWxH 3.2 X 2.5 X 1.2 mm
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3D Models
TFM322512ALMAR10MTAA - TDK  - 3D model - Inductors Chip - LxWxH 3.2 X 2.5 X 1.2 mm
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TFM322512ALMAR10MTAA Details

  • Manufacturer Part Number:

    TFM322512ALMAR10MTAA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.9

  • Case/Size Code:

    1210

  • Construction:

    Rectangular

  • Core Material:

    Metal

  • DC Resistance:

    0.008 Ω

  • Inductance-Nom (L):

    0.1 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    1.2 mm

  • Package Length:

    3.2 mm

  • Package Style:

    SMT

  • Package Width:

    2.5 mm

  • Packing Method:

    TR, Embossed Plastic, 7 Inch

  • Rated Current-Max:

    8 A

  • Reference Standard:

    AEC-Q200

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

TFM322512ALMAR10MTAA Frequently Asked Questions (FAQs)

  • The recommended land pattern for TFM322512ALMAR10MTAA can be found in the TDK Corporation's application note or footprint recommendation document, which provides detailed information on the recommended pad layout, size, and spacing for optimal performance and reliability.
  • Thermal management is critical for TFM322512ALMAR10MTAA. It's recommended to use a thermal pad or heat sink to dissipate heat, and ensure good airflow around the component. The thermal resistance of the component should also be considered in the design to prevent overheating.
  • The maximum operating temperature range for TFM322512ALMAR10MTAA is typically specified in the datasheet, but it's essential to note that the component may have different temperature ratings for storage, operation, and reflow soldering. Always check the datasheet or consult with TDK Corporation for specific temperature ratings.
  • TFM322512ALMAR10MTAA is designed to meet specific vibration and shock requirements, but it's crucial to evaluate the component's performance in the specific application environment. TDK Corporation may provide additional information or testing data to support the use of TFM322512ALMAR10MTAA in high-vibration environments.
  • To ensure the reliability of TFM322512ALMAR10MTAA, it's essential to follow proper design and manufacturing guidelines, including using recommended soldering profiles, handling, and storage procedures. Additionally, consider implementing reliability testing, such as temperature cycling, vibration, and humidity testing, to validate the component's performance in the specific application.

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TFM322512ALMAR10MTAA Overview

Use the download button to access the TFM322512ALMAR10MTAA schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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