Matte Tin (Sn) - reflowed over Nickel (Ni) barrier
Transformer Type:
DATACOM TRANSFORMER
Width:
7.11 mm
TG110-RPE5N5LF Frequently Asked Questions (FAQs)
The recommended PCB layout and land pattern can be found in the manufacturer's application note or by contacting Halo Electronics Inc directly. A good rule of thumb is to follow the IPC-7351 standard for land pattern design and to ensure a solid ground plane under the component.
The TG110-RPE5N5LF has a thermal resistance of 25°C/W. To handle thermal management, ensure good airflow around the component, use a heat sink if necessary, and follow the recommended PCB layout guidelines. Additionally, consider using thermal interface materials to reduce thermal resistance.
The recommended soldering profile for the TG110-RPE5N5LF is a peak temperature of 240°C for 1-2 seconds, with a total process time of 60-90 seconds. However, it's recommended to consult the manufacturer's application note or contact Halo Electronics Inc for specific guidance.
Yes, the TG110-RPE5N5LF is a sensitive component and requires proper ESD handling precautions. Handle the component in an ESD-controlled environment, use ESD-safe packaging and tools, and ensure that personnel handling the component are grounded.
Store the TG110-RPE5N5LF in its original packaging, in a dry and cool environment, away from direct sunlight and moisture. Avoid bending or flexing the component, and handle it by the body, not the leads.
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TG110-RPE5N5LF Overview
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