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TG111-MSCHPLF - Halo Electronics

Description: Audio Transformers / Signal Transformers Genesus -40/+85C Mini 1G For MiniPhy

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TG111-MSCHPLF - Halo Electronics - PCB symbol
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PCB Footprints
TG111-MSCHPLF - Halo Electronics PCB footprint - Small Outline Packages - Small Outline Packages - TG111
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3D Models
TG111-MSCHPLF - Halo Electronics - 3D model - Small Outline Packages - TG111
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TG111-MSCHPLF Details

  • Manufacturer Part Number:

    TG111-MSCHPLF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Halo Electronics Inc

  • YTEOL:

    6.65

  • Additional Feature:

    HEIGHT DIMENSION INCLUDES TERMINALS ALSO

  • Application:

    ETHERNET

  • Approvals:

    UL

  • Height:

    8.64 mm

  • Isolation Voltage:

    1500 V

  • Length:

    14.22 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Primary Inductance:

    350 µH

  • Surface Mount:

    YES

  • Transformer Type:

    DATACOM TRANSFORMER

  • Turns Ratio (Np:Ns):

    1CT:1CT

  • Width:

    7.62 mm

TG111-MSCHPLF Frequently Asked Questions (FAQs)

  • A symmetrical layout with a solid ground plane and minimal signal trace length is recommended. It's also important to keep the input and output traces separate to minimize crosstalk.
  • The TG111-MSCHPLF requires a bias voltage of 3.3V or 5V, depending on the application. Ensure the bias voltage is stable and within the recommended range to achieve optimal performance.
  • The TG111-MSCHPLF is rated for operation from -40°C to +85°C. However, it's recommended to derate the device for high-temperature applications to ensure reliability.
  • While the TG111-MSCHPLF is designed for high-frequency applications, its performance may degrade above 1 GHz. It's recommended to consult with Halo Electronics Inc or perform thorough testing to ensure the device meets the specific application requirements.
  • A peak reflow temperature of 260°C with a dwell time of 20-30 seconds is recommended. Ensure the soldering process is within the recommended specifications to prevent damage to the device.

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TG111-MSCHPLF Overview

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