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TH58BVG3S0HTA00 - Toshiba

Description: NAND Flash 8Gb 24nm SLC NAND (EEPROM)

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TH58BVG3S0HTA00 - Toshiba PCB footprint - Small Outline Packages - Small Outline Packages - tsop I 48-P-1220-0.50
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3D Models
TH58BVG3S0HTA00 - Toshiba  - 3D model - Small Outline Packages - tsop I 48-P-1220-0.50
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TH58BVG3S0HTA00 Details

  • Manufacturer Part Number:

    TH58BVG3S0HTA00

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    TSOP1

  • Package Description:

    TSOP1-48

  • Pin Count:

    48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Toshiba America Electronic Components

  • Access Time-Max:

    25 ns

  • JESD-30 Code:

    R-PDSO-G48

  • Length:

    18.4 mm

  • Memory Density:

    8589934592 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Words:

    1073741824 words

  • Number of Words Code:

    1000000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    1GX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP1

  • Package Equivalence Code:

    TSSOP48,.8,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3.3 V

  • Seated Height-Max:

    1.2 mm

  • Standby Current-Max:

    0.00005 A

  • Supply Current-Max:

    0.03 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Type:

    NAND TYPE

  • Width:

    12 mm

  • Write Cycle Time-Max (tWC):

    0.000025 ms

  • Write Protection:

    HARDWARE

TH58BVG3S0HTA00 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the TH58BVG3S0HTA00 is -40°C to 85°C.
  • Toshiba recommends following the standard reflow soldering profile and using a soldering iron with a temperature of 350°C or less to avoid damaging the device.
  • The TH58BVG3S0HTA00 has a maximum of 100,000 erase cycles per block, and 10,000 erase cycles per chip.
  • Toshiba recommends using a voltage detector and a capacitor to ensure that the device has enough power to complete any write operations in progress during a power failure.
  • The typical access time for the TH58BVG3S0HTA00 is 25ns.

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TH58BVG3S0HTA00 Overview

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