TH58BYG3S0HBAI6 - Toshiba

TH58BYG3S0HBAI6 Details

• Manufacturer Part Number:

  TH58BYG3S0HBAI6

• Part Life Cycle Code:

  Transferred

• Package Description:

  VFBGA-67

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.51

• Manufacturer:

  Toshiba America Electronic Components

• JESD-30 Code:

  R-PBGA-B67

• Length:

  8 mm

• Memory Density:

  8589934592 bit

• Memory IC Type:

  FLASH

• Memory Width:

  8

• Number of Functions:

  1

• Number of Terminals:

  67

• Number of Words:

  1073741824 words

• Number of Words Code:

  1000000000

• Operating Mode:

  ASYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  1GX8

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  VFBGA

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, VERY THIN PROFILE, FINE PITCH

• Parallel/Serial:

  PARALLEL

• Programming Voltage:

  1.8 V

• Seated Height-Max:

  1 mm

• Supply Voltage-Max (Vsup):

  1.95 V

• Supply Voltage-Min (Vsup):

  1.7 V

• Supply Voltage-Nom (Vsup):

  1.8 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Width:

  6.5 mm