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TH58NVG2S3HTA00 - Toshiba

Description: NAND Flash 4Gb 24nm SLC NAND (EEPROM)

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TH58NVG2S3HTA00 - Toshiba PCB footprint - Small Outline Packages - Small Outline Packages - tsop I 48-P-1220-0.50
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TH58NVG2S3HTA00 - Toshiba  - 3D model - Small Outline Packages - tsop I 48-P-1220-0.50
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TH58NVG2S3HTA00 Details

  • Manufacturer Part Number:

    TH58NVG2S3HTA00

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    TSOP-48

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    2

  • JESD-30 Code:

    R-PDSO-G48

  • Length:

    18.4 mm

  • Memory Density:

    4294967296 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Words:

    536870912 words

  • Number of Words Code:

    512000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    512MX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TSSOP48,.8,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3.3 V

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Type:

    SLC NAND TYPE

  • Width:

    12 mm

  • Write Protection:

    HARDWARE

TH58NVG2S3HTA00 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the TH58NVG2S3HTA00 is -40°C to 85°C.
  • To prevent damage, it is recommended to follow the soldering temperature profile specified in the datasheet, and to avoid applying excessive force or bending during the soldering process.
  • The TH58NVG2S3HTA00 supports up to 100,000 erase cycles.
  • Yes, the TH58NVG2S3HTA00 supports high-speed data transfer rates of up to 52 MB/s for sequential read and 20 MB/s for sequential write.
  • To ensure data integrity, it is recommended to implement error correction mechanisms, such as ECC, and to follow proper data writing and reading procedures as specified in the datasheet.

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TH58NVG2S3HTA00 Overview

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Part Image TH58NVG2S3HTA00 KIOXIA

Flash, 512MX8, PDSO48