Melexis recommends a PCB layout with a large copper area connected to the thermal pad (exposed die attach) to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the copper area should be connected to a solid ground plane to reduce thermal resistance.
To minimize the effects of vibration on temperature measurements, Melexis recommends using a rigid PCB design, securing the sensor to a stable mounting point, and using a low-pass filter to reduce noise. Additionally, averaging multiple measurements can help improve accuracy.
Although the datasheet specifies a recommended operating voltage range of 3.3V to 5.5V, Melexis recommends not exceeding 5.25V on the VDD pin to ensure reliable operation and prevent damage to the device.
While the device is not hermetically sealed, Melexis recommends using a conformal coating or potting compound to protect the device from moisture. However, the device is not designed for use in environments with high humidity or condensation, and Melexis advises against using it in such conditions.
Melexis recommends a two-point calibration procedure, where the device is calibrated at two known temperature points (e.g., 0°C and 100°C) to determine the offset and gain coefficients. These coefficients can then be used to correct temperature measurements across the operating range.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
TH72035KLD-BAA-000-TU Overview
Use the download button to access the TH72035KLD-BAA-000-TU schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like TH720,
or try a keyword search, such as Other RF/Microwave Devices
