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THGAMRG9T23BAIL - Toshiba

Description: eMMC 64GB eMMC 5.1 3D BiCS -25C to 85C

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Symbol

THGAMRG9T23BAIL - Toshiba - PCB symbol

PCB Footprints

THGAMRG9T23BAIL - Toshiba PCB footprint - BGA - BGA - P-WFBGA153-1113-0.50 (11.5mm x 13mm, H0.8mm max. package)

3D Models

THGAMRG9T23BAIL - Toshiba - 3D model - BGA - P-WFBGA153-1113-0.50 (11.5mm x 13mm, H0.8mm max. package)

Datasheet Download Datasheet
Stock & Prices Price & Stock for THGAMRG9T23BAIL
Part Number THGAMRG9T23BAIL
Manufacturer Toshiba
Pin Count 153
Part Category Integrated Circuit
Package Category BGA
Footprint Name BGA - P-WFBGA153-1113-0.50 (11.5mm x 13mm, H0.8mm max. package)
Released Date Mar 26, 2022
Last Modified Date Mar 7, 2023 4:10 PM UTC
Pinout / Pin List Click Here (Member Only)

THGAMRG9T23BAIL Details

Manufacturer Part Number:
THGAMRG9T23BAIL
Manufacturer:
Toshiba America Electronic Components

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