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THGJFGT1E45BAIP - KIOXIA Corporation

Description: Universal Flash Storage - UFS 256GB UFS v3.1 153-Pin BGA

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PCB Footprints
THGJFGT1E45BAIP - KIOXIA Corporation PCB footprint - BGA - BGA - P-WFBGA153-0.50-702 (11mm x 13mm, H0.8mm(max.)
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3D Models
THGJFGT1E45BAIP - KIOXIA Corporation  - 3D model - BGA - P-WFBGA153-0.50-702 (11mm x 13mm, H0.8mm(max.)
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THGJFGT1E45BAIP Details

  • Manufacturer Part Number:

    THGJFGT1E45BAIP

  • Part Life Cycle Code:

    Active

  • Package Description:

    BGA-153

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    KIOXIA

  • YTEOL:

    7

  • JESD-30 Code:

    R-PBGA-B153

  • Length:

    13 mm

  • Memory Density:

    2199023255552 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    153

  • Number of Words:

    274877906944 words

  • Number of Words Code:

    256000000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Organization:

    256GX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA153,14X14,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3 V

  • Seated Height-Max:

    0.8 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Type:

    MLC NAND TYPE

  • Width:

    11 mm

THGJFGT1E45BAIP Frequently Asked Questions (FAQs)

  • The typical power consumption is around 2.3W (active) and 1.3W (idle), but this may vary depending on the workload and usage scenario.
  • The drive has a built-in thermal management system that throttles performance to prevent overheating. The exact temperature threshold is not publicly disclosed, but it's designed to ensure reliable operation within a typical operating temperature range of 0°C to 70°C.
  • The drive has a total bytes written (TBW) rating of 600TB, which means it can withstand a certain amount of write cycles before the drive's lifespan is exhausted. This rating is based on a typical usage scenario and may vary depending on the specific use case.
  • Yes, the drive supports TCG Opal 2.0 and IEEE 1667 encryption standards, which provide hardware-based encryption for secure data storage.
  • The drive is designed for client and enterprise applications, such as desktop and laptop computers, as well as data center and cloud storage environments. It's suitable for a wide range of workloads, including read-intensive and mixed workloads.

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THGJFGT1E45BAIP Overview

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