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TIP29 - Central Semiconductor

Description: Bipolar Transistors - BJT NPN Gen Purp Power

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TIP29 - Central Semiconductor PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TIP29
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TIP29 - Central Semiconductor  - 3D model - Transistor Outline, Vertical - TIP29
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TIP29 Details

  • Manufacturer Part Number:

    TIP29

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220AB

  • Package Description:

    TO-220, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Central Semiconductor Corp

  • YTEOL:

    0

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    1 A

  • Collector-Emitter Voltage-Max:

    40 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    15

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e0

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    NPN

  • Power Dissipation Ambient-Max:

    2 W

  • Power Dissipation-Max (Abs):

    30 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    3 MHz

  • VCEsat-Max:

    0.7 V

TIP29 Frequently Asked Questions (FAQs)

  • The maximum safe operating area (SOA) for the TIP29 is not explicitly stated in the datasheet. However, it's recommended to follow the general guidelines for power transistors, which is to limit the voltage and current to 80% of the maximum ratings to ensure reliable operation.
  • The thermal resistance of the TIP29 can be calculated using the junction-to-case thermal resistance (RθJC) and the case-to-ambient thermal resistance (RθCA). The RθJC is typically around 1.5°C/W, and the RθCA depends on the heat sink and ambient temperature. You can use the following formula: RθJA = RθJC + RθCA.
  • The recommended heat sink for the TIP29 depends on the application and the maximum power dissipation required. A general rule of thumb is to use a heat sink with a thermal resistance of 1°C/W or lower. You can use online heat sink calculators or consult with a thermal management expert to determine the suitable heat sink for your specific application.
  • The TIP29 is not suitable for high-frequency switching applications due to its relatively high transition frequency (ft) of around 3 MHz. It's recommended to use a transistor with a higher ft, such as the TIP120 or TIP142, for high-frequency switching applications.
  • To protect the TIP29 from ESD, follow proper handling and storage procedures, such as using anti-static wrist straps, mats, and bags. You can also add ESD protection devices, such as TVS diodes or ESD protection arrays, to your circuit design.

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TIP29 Alternates

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Image Part Number Model
Part Image TIP29B JW Miller

1A, 80V, NPN, Si, POWER TRANSISTOR, TO-220, TO-220, 3 PIN

Part Image TIP29A Samsung Semiconductor

Power Bipolar Transistor, 1A I(C), 60V V(BR)CEO, 1-Element, NPN, Silicon, TO-220AB, Plastic/Epoxy, 3 Pin

Part Image TIP29C Microsemi Corporation (now Microchip)

Power Bipolar Transistor, 1A I(C), 100V V(BR)CEO, NPN, Silicon, TO-220, Plastic/Epoxy, 3 Pin

Part Image TIP29B Microsemi Corporation (now Microchip)

Power Bipolar Transistor, 1A I(C), 80V V(BR)CEO, NPN, Silicon, TO-220, Plastic/Epoxy, 3 Pin

Part Image TIP29 NXP Semiconductors

Power Bipolar Transistor, 1A I(C), 40V V(BR)CEO, 1-Element, NPN, Silicon, TO-220AB, Plastic/Epoxy, 3 Pin

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