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TIP33CG - onsemi

Description: 10 A Collector Current; Low Leakage Current - ICEO = 0.7 mA @ 60 V; Excellent dc Gain - hFE = 40 Typ @ 3.0 A; High Current Gain Bandwidth Product - hfe = 3.0 min @ IC = 0.5 A, f = 1.0 MHz; Pb-Free Packages are Available

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PCB Footprints
TIP33CG - onsemi PCB footprint - Other - Other - TIP33CG-5
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TIP33CG - onsemi  - 3D model - Other - TIP33CG-5
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TIP33CG Details

  • Manufacturer Part Number:

    TIP33CG

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-247

  • Pin Count:

    3

  • Manufacturer Package Code:

    340L

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    4

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    10 A

  • Collector-Emitter Voltage-Max:

    100 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    20

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    80 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    3 MHz

TIP33CG Frequently Asked Questions (FAQs)

  • The maximum SOA for the TIP33CG is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal resistance and maximum junction temperature. A safe operating area can be assumed to be around 10A and 30V.
  • To ensure linear operation, the TIP33CG should be biased in the active region, which is typically between 1-5V base-emitter voltage and 0.5-2A collector current. The base resistor value should be chosen to provide a stable bias point.
  • A good PCB layout for the TIP33CG should provide a low-thermal-resistance path from the device to a heat sink or thermal pad. A copper pour or thermal vias can be used to dissipate heat. A heat sink with a thermal resistance of around 10°C/W is recommended.
  • While the TIP33CG is primarily designed for linear applications, it can be used in switching applications with some caution. The device's switching characteristics, such as turn-on and turn-off times, should be carefully evaluated to ensure it meets the application's requirements.
  • To protect the TIP33CG from ESD, handling precautions should be taken, such as using an anti-static wrist strap or mat, and storing the devices in anti-static packaging. Additionally, ESD protection diodes or resistors can be added to the circuit to protect the device.

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TIP33CG Overview

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