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TISP4350M3BJR-S - Bourns

Description: Thyristor Surge Protection Devices - TSPD 275V 600mA

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TISP4350M3BJR-S - Bourns - PCB symbol
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PCB Footprints
TISP4350M3BJR-S - Bourns PCB footprint - Diodes Moulded Non Polarised - Diodes Moulded Non Polarised - SMB (DO-214AA)_2023-1
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TISP4350M3BJR-S - Bourns - 3D model - Diodes Moulded Non Polarised - SMB (DO-214AA)_2023-1
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TISP4350M3BJR-S Details

  • Manufacturer Part Number:

    TISP4350M3BJR-S

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AA

  • Package Description:

    SMBJ, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    UK

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    6

  • Breakover Voltage-Max:

    350 V

  • Configuration:

    SINGLE

  • DC Off-state Voltage-Max:

    275 V

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-Repetitive Pk On-state Cur:

    32 A

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Trigger Device Type:

    THYRISTOR SURGE PROTECTOR

TISP4350M3BJR-S Frequently Asked Questions (FAQs)

  • A good PCB layout for the TISP4350M3BJR-S should minimize lead lengths, use a solid ground plane, and keep the device away from high-frequency noise sources. A 4-layer PCB with a dedicated ground plane is recommended.
  • Use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Ensure the device is aligned properly and soldered within 10 seconds to prevent thermal damage.
  • The TISP4350M3BJR-S can operate safely between -40°C to 125°C, but the device's performance may degrade above 85°C. Ensure proper thermal management to maintain optimal performance.
  • Yes, the TISP4350M3BJR-S is designed to withstand vibrations up to 10g peak acceleration. However, ensure the device is properly secured to the PCB and the PCB is securely fastened to the system to prevent mechanical stress.
  • Start by verifying the device is properly soldered and powered. Check for signs of overheating, electrical overstress, or physical damage. Use an oscilloscope to monitor the device's output and input signals to identify any anomalies.

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TISP4350M3BJR-S Overview

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