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TL331VSN4T3G - onsemi

Description: AEC-Q100 Qualified option available; Wide Single Supply Voltage Range or Dual Supplies; Low Supply Current; Low Input Bias Current: 25 nA; Low Input Offset Current: ±5 nA; Low Input Offset Voltage: ±2 mV; Input Common Mode Voltage Range includes Ground; Low Output Saturation Voltage: 150 mV typ at IO = 4 mA; Differential Input Voltage Range Equal to the Supply Voltage

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PCB Footprints
TL331VSN4T3G - onsemi PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - TSOP-5 Case 483 Issue M
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3D Models
TL331VSN4T3G - onsemi  - 3D model - SOT23 (5-Pin) - TSOP-5 Case 483 Issue M
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TL331VSN4T3G Details

  • Manufacturer Part Number:

    TL331VSN4T3G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    TSOP-5 / SOT-23-5

  • Manufacturer Package Code:

    483

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    3

  • Amplifier Type:

    COMPARATOR

  • Average Bias Current-Max (IIB):

    0.4 µA

  • Bias Current-Max (IIB) @25C:

    0.25 µA

  • Input Offset Voltage-Max:

    9000 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Type:

    OPEN-COLLECTOR

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Response Time-Nom:

    850 ns

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    1.25 mA

  • Supply Voltage Limit-Max:

    36 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.5 mm

TL331VSN4T3G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure proper PCB design, and consider using a thermistor or thermocouple for temperature monitoring.
  • Use X7R or X5R ceramic capacitors with a voltage rating of 10V or higher. For input capacitors, 1-10uF is recommended, while output capacitors should be 10-22uF. Ensure the capacitors are placed close to the device pins.
  • Use a shielded enclosure, and ensure the PCB is designed with EMI reduction in mind. Implement a common-mode choke or ferrite bead on the input lines, and consider adding a Pi-filter or common-mode filter.
  • Follow the JEDEC J-STD-020D.1 standard for reflow soldering. The recommended peak temperature is 260°C, with a maximum time above 217°C of 60 seconds.

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TL331VSN4T3G Overview

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