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TLD1211SJFUMA1 - Infineon

Description: LED Lighting Drivers Infineon Basic LED Driver

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TLD1211SJFUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - TLD1211SJFUMA1
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TLD1211SJFUMA1 Details

  • Manufacturer Part Number:

    TLD1211SJFUMA1

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    GREEN, PLASTIC PACKAGE-8

  • Pin Count:

    8

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7.89

  • Data Input Mode:

    SERIAL

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    2A

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    CONSTANT-CURRENT

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    1.7 mA

  • Supply Voltage-Max:

    28 V

  • Supply Voltage-Min:

    8 V

  • Supply Voltage-Nom:

    14 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    4 mm

TLD1211SJFUMA1 Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Infineon recommends following the IEC 61967 standard for EMC, using a shielded cable, and placing the device at least 10mm away from other components to minimize electromagnetic interference.
  • The maximum allowed voltage on the input pins is 6V, exceeding which may cause permanent damage to the device.
  • Infineon recommends using a soldering iron with a temperature below 260°C, and avoiding the use of ultrasonic cleaning or vapor phase soldering to prevent damage to the device.
  • Infineon recommends storing the device in a dry, cool place (below 30°C and 60% relative humidity) to prevent moisture absorption and damage.

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TLD1211SJFUMA1 Overview

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