SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
Screening Level:
AEC-Q100
Seated Height-Max:
1.15 mm
Supply Current-Max:
3 mA
Supply Voltage-Max:
18 V
Supply Voltage-Min:
5.5 V
Supply Voltage-Nom:
13.5 V
Surface Mount:
YES
Temperature Grade:
INDUSTRIAL
Terminal Finish:
Tin (Sn)
Terminal Form:
GULL WING
Terminal Pitch:
0.65 mm
Terminal Position:
DUAL
Width:
3.9 mm
TLD21413EPXUMA1 Frequently Asked Questions (FAQs)
Infineon recommends a 2-layer or 4-layer PCB with a solid ground plane and thermal vias to ensure efficient heat dissipation. A minimum of 1 oz copper thickness is recommended.
To ensure EMC, Infineon recommends following the guidelines in the IEC 61967 standard. Additionally, use a shielded cable, and keep the device away from high-frequency sources.
The maximum allowed voltage on the input pins is 5.5V. Exceeding this voltage may damage the device.
Yes, the TLD21413EPXUMA1 is AEC-Q100 qualified, making it suitable for automotive applications. However, ensure compliance with the specific automotive standard requirements.
Follow the recommended soldering profile and handling procedures outlined in the Infineon application note AN2018-01 to prevent damage during soldering and rework.
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TLD21413EPXUMA1 Overview
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