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TLD23313EPXUMA1 - Infineon

Description: LED Lighting Drivers

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TLD23313EPXUMA1 - Infineon - PCB symbol
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PCB Footprints
TLD23313EPXUMA1 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-TSDSO-14-22
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TLD23313EPXUMA1 - Infineon - 3D model - Small Outline Packages - PG-TSDSO-14-22
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TLD23313EPXUMA1 Details

  • Manufacturer Part Number:

    TLD23313EPXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSSOP-14

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    26 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7.78

  • Data Input Mode:

    SERIAL

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    2A

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    9

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    115 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC

  • Package Code:

    HTSSOP

  • Package Equivalence Code:

    SSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.15 mm

  • Supply Current-Max:

    3 mA

  • Supply Voltage-Max:

    18 V

  • Supply Voltage-Min:

    5.5 V

  • Supply Voltage-Nom:

    13.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

TLD23313EPXUMA1 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 4-layer PCB with a solid ground plane and a thermal via array can help to dissipate heat efficiently.
  • To ensure EMC, it is recommended to follow good PCB design practices, such as using a solid ground plane, minimizing loop areas, and using shielding and filtering components as needed. Additionally, the device should be placed in a shielded enclosure and connected to a low-impedance ground plane.
  • The recommended operating voltage range for the TLD23313EPXUMA1 is 5.5 V to 40 V. Operating the device outside of this range may affect its performance and reliability.
  • To protect the device from overvoltage and overcurrent, it is recommended to use voltage regulators, current limiters, and overvoltage protection (OVP) circuits. Additionally, the device should be connected to a fuse or a polyfuse to prevent damage from excessive current.
  • The recommended storage temperature range for the TLD23313EPXUMA1 is -40°C to 125°C. Storing the device outside of this range may affect its performance and reliability.

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TLD23313EPXUMA1 Overview

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