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TLE6251-2G - Infineon

Description: CAN 1MBd Sleep/Standby 5V Automotive 14-Pin DSO T/R

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TLE6251-2G - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO-14 height 1.75
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TLE6251-2G - Infineon  - 3D model - Small Outline Packages - PG-DSO-14 height 1.75
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TLE6251-2G Details

  • Manufacturer Part Number:

    TLE6251-2G

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-14

  • Pin Count:

    14

  • Country Of Origin:

    Malaysia, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3

  • Data Rate:

    1000 Mbps

  • JESD-30 Code:

    R-PDSO-G14

  • Length:

    8.75 mm

  • Moisture Sensitivity Level:

    2A

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Number of Transceivers:

    1

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    0.08 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BCDMOS

  • Telecom IC Type:

    INTERFACE CIRCUIT

  • Terminal Finish:

    Nickel/Gold/Palladium (Ni/Au/Pd)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    4 mm

TLE6251-2G Frequently Asked Questions (FAQs)

  • A good PCB layout for the TLE6251-2G involves keeping the high-current paths short and wide, using a solid ground plane, and placing the device close to the power source. Additionally, it's recommended to use a common mode choke and a shielded cable to reduce EMI.
  • The choice of external components for the TLE6251-2G depends on the specific application requirements. For example, the choice of inductor value depends on the output voltage, output current, and switching frequency. The datasheet provides guidelines for selecting the inductor, capacitor, and resistor values.
  • The TLE6251-2G is rated for an ambient temperature range of -40°C to 150°C. However, the device's performance and reliability may be affected at extreme temperatures, so it's essential to consider the thermal design and heat dissipation in the system.
  • The TLE6251-2G has a built-in overcurrent protection feature that can be enabled by connecting the OCP pin to a resistor and capacitor network. The datasheet provides a detailed description of the overcurrent protection circuit and the calculation of the OCP threshold.
  • Yes, the TLE6251-2G is suitable for high-reliability applications. It's manufactured using a robust process, and Infineon provides a detailed reliability report and failure-in-time (FIT) rate data to support the device's use in high-reliability applications.

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TLE6251-2G Overview

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