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TLE6251DSXUMA2 - Infineon

Description: CAN Interface IC TRANSCEIVER

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TLE6251DSXUMA2 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 8-SOIC-+-
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TLE6251DSXUMA2 Details

  • Manufacturer Part Number:

    TLE6251DSXUMA2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    GREEN, PLASTIC, SOP-8

  • Country Of Origin:

    Malaysia, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    2A

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    INTERFACE CIRCUIT

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    4 mm

TLE6251DSXUMA2 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the TLE6251DSXUMA2 can be found in the Infineon application note AN215 'Layout Recommendations for TLE6251' which provides guidelines for optimal PCB design and layout to ensure proper operation and minimize electromagnetic interference (EMI).
  • The choice of external components such as resistors, capacitors, and inductors depends on the specific application and operating conditions. Infineon provides a component selection guide in the datasheet and application notes, which can be used as a starting point for component selection. Additionally, simulation tools such as LTspice can be used to simulate and optimize the design.
  • The TLE6251DSXUMA2 has a maximum junction temperature of 150°C. To ensure reliable operation, it is essential to provide adequate thermal management, such as heat sinks, thermal vias, and thermal interface materials. The thermal resistance of the package (RthJA) is specified in the datasheet, and thermal simulation tools can be used to optimize the thermal design.
  • Troubleshooting issues with the TLE6251DSXUMA2 can be challenging. Infineon provides a troubleshooting guide in the application note AN216 'Troubleshooting Guide for TLE6251' which provides a step-by-step approach to identify and resolve common issues. Additionally, oscilloscopes, logic analyzers, and other diagnostic tools can be used to debug the design.
  • The TLE6251DSXUMA2 is designed to meet electromagnetic compatibility (EMC) and electromagnetic interference (EMI) standards. To ensure compliance, it is essential to follow the layout recommendations, use shielding, and implement EMI filters as necessary. Infineon provides guidelines for EMI and EMC in the application note AN217 'EMI and EMC Considerations for TLE6251'.

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TLE6251DSXUMA2 Overview

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