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TLE8209-2SA - Infineon

Description: Infineon TLE8209-2SA, BLDC Motor Driver IC, 28 V 8.6A 20-Pin, DSO-20-65

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TLE8209-2SA - Infineon - PCB symbol
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TLE8209-2SA - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - TLE8209-2SA
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TLE8209-2SA Details

  • Manufacturer Part Number:

    TLE8209-2SA

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    GREEN, PLASTIC, SOP-20

  • Pin Count:

    20

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3

  • Built-in Protections:

    OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE

  • Interface IC Type:

    HALF BRIDGE BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    15.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SOURCE AND SINK

  • Output Peak Current Limit-Nom:

    8.6 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.5 mm

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.4 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    28 V

  • Supply Voltage1-Min:

    4.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    11 mm

TLE8209-2SA Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the TLE8209-2SA near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the PCB. A 4-layer PCB with a solid ground plane and a thermal via array can help to dissipate heat efficiently.
  • To ensure EMC, use a shielded cable for the output stage, and consider adding a common-mode choke and a ferrite bead to the output lines. Additionally, ensure that the PCB layout is designed to minimize electromagnetic radiation and susceptibility.
  • A ceramic capacitor with a value of 10uF to 22uF is recommended for the input stage. The capacitor should be placed as close as possible to the VIN pin to minimize noise and ensure stable operation.
  • Use a voltage supervisor or a reset IC to monitor the input voltage and reset the device if it falls outside the recommended operating range. Additionally, consider adding overvoltage protection (OVP) and undervoltage protection (UVP) circuits to prevent damage to the device.
  • A ceramic capacitor with a value of 10uF to 22uF is recommended for the output stage. The capacitor should be placed as close as possible to the VOUT pin to minimize noise and ensure stable operation.

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TLE8209-2SA Overview

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