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TLE8250GVIO - Infineon

Description: CAN Interface IC High Speed CAN Transceiver

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TLE8250GVIO - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-DSO8
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TLE8250GVIO Details

  • Manufacturer Part Number:

    TLE8250GVIO

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    SOIC

  • Package Description:

    PACKAGE-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    2A

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Transceivers:

    1

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    0.07 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Telecom IC Type:

    INTERFACE CIRCUIT

  • Terminal Finish:

    Nickel/Gold/Palladium (Ni/Au/Pd)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    4 mm

TLE8250GVIO Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in the application note AN2015-01, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • Infineon provides a range of application notes and design guides that provide configuration guidelines for specific automotive applications, such as battery management systems, power distribution systems, and automotive networking systems. Engineers can also consult with Infineon's technical support team for customized configuration guidance.
  • The TLE8250GVIO has a maximum junction temperature of 150°C. Engineers should ensure that the device is properly cooled through the use of heat sinks, thermal interfaces, and airflow management. Infineon provides thermal management guidelines in the datasheet and application notes.
  • Infineon provides a range of troubleshooting resources, including application notes, FAQs, and technical support. Engineers can also use diagnostic tools such as oscilloscopes and logic analyzers to identify issues with the device. Additionally, Infineon's technical support team can provide customized troubleshooting guidance.
  • The TLE8250GVIO is designed to meet the safety and reliability requirements of the automotive industry. Engineers should ensure that the device is used within its specified operating conditions and follows the guidelines outlined in the datasheet and application notes. Additionally, Infineon provides safety and reliability data in the device's safety manual and failure mode effects and diagnostic analysis (FMEDA) report.

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