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TLF1963TEATMA1 - Infineon

Description: INFINEON - TLF1963TEATMA1 - LDO Voltage Regulator, Adjustable, 2.5V to 20V, 340mV drop., 1.21V to 19.66V/1.5A out,TO-252-5

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PCB Footprints
TLF1963TEATMA1 - Infineon PCB footprint - Other - Other - PG-TO252-5_2021
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3D Models
TLF1963TEATMA1 - Infineon  - 3D model - Other - PG-TO252-5_2021
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TLF1963TEATMA1 Details

  • Manufacturer Part Number:

    TLF1963TEATMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-252, 5/4 PIN

  • Country Of Origin:

    Austria, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6.7

  • Adjustability:

    ADJUSTABLE

  • Dropout Voltage1-Max:

    0.55 V

  • Dropout Voltage1-Nom:

    0.34 V

  • JESD-30 Code:

    R-PSSO-G4

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Line Regulation-Max (%/V):

    0.01393

  • Load Regulation-Max(%):

    0.9917%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    4

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    1.5 A

  • Output Voltage1-Max:

    19.45 V

  • Output Voltage1-Min:

    1.21 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TO-252

  • Package Equivalence Code:

    SMSIP5H,.37,50TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Regulator Type:

    ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.5 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.14 mm

  • Terminal Position:

    SINGLE

  • Width:

    6.22 mm

TLF1963TEATMA1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a thermal pad to dissipate heat efficiently.
  • Monitor the device's junction temperature, voltage, and current to ensure they are within the specified limits. Use a thermal management system and a voltage regulator to prevent overheating and overvoltage.
  • A ceramic capacitor with a value of 10uF to 22uF and a voltage rating of 25V or higher is recommended. The capacitor should be placed as close as possible to the device's input pins.
  • Use a fuse or a current limiter to prevent overcurrent. Add a voltage regulator or a TVS diode to protect against overvoltage. Ensure the device is operated within the specified voltage and current limits.
  • A reflow soldering profile with a peak temperature of 260°C and a dwell time of 30-60 seconds is recommended. Ensure the device is soldered in a nitrogen atmosphere to prevent oxidation.

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TLF1963TEATMA1 Overview

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