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TLF50281ELXUMA3 - Infineon

Description: Buck Switching Regulator IC Positive Fixed 5V 1 Output 500mA 14-LSSOP (0.154", 3.90mm Width) Exposed Pad

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TLF50281ELXUMA3 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - PG-SSOP-14
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TLF50281ELXUMA3 - Infineon  - 3D model - Small Outline Packages - PG-SSOP-14
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TLF50281ELXUMA3 Details

  • Manufacturer Part Number:

    TLF50281ELXUMA3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SSOP-14

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7.7

  • Additional Feature:

    ALSO OPERATES IN PFM CONTROL TECHNIQUE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    45 V

  • Input Voltage-Min:

    4.75 V

  • Input Voltage-Nom:

    7 V

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.5 A

  • Output Voltage-Max:

    5.1 V

  • Output Voltage-Min:

    4.9 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HLSSOP

  • Package Equivalence Code:

    SSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, LOW PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.7 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2200 kHz

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    3.9 mm

TLF50281ELXUMA3 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN2013-01, which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended thermal design guidelines, use a suitable thermal interface material, and consider derating the device's power handling capabilities according to the temperature derating curve provided in the datasheet.
  • The internal ESD protection of the TLF50281ELXUMA3 can affect the system-level ESD design. It's essential to consider the device's ESD protection capabilities when designing the system-level ESD protection to avoid overvoltage stress and ensure reliable operation.
  • To troubleshoot issues related to the device's overcurrent protection, check the device's fault pin, monitor the current sense resistor, and verify that the device is properly configured and powered. Consult the datasheet and application notes for guidance on troubleshooting and fault detection.
  • The quiescent current of the TLF50281ELXUMA3 can impact the system's power consumption, especially in low-power or battery-powered applications. Consider the device's quiescent current when designing the system's power budget and optimizing power consumption.

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