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TLF80511TFV33ATMA1 - Infineon

Description: INFINEON - TLF80511TFV33ATMA1 - LDO, FIXED, AEC-Q100, 3.3V, 0.4A, TO-252

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TLF80511TFV33ATMA1 - Infineon PCB footprint - Other - Other - PG-TO252 -3_ffw
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TLF80511TFV33ATMA1 - Infineon  - 3D model - Other - PG-TO252 -3_ffw
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TLF80511TFV33ATMA1 Details

  • Manufacturer Part Number:

    TLF80511TFV33ATMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TO-252, 3/2 PIN

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.65 V

  • Dropout Voltage1-Nom:

    0.32 V

  • Input Voltage Absolute-Max:

    45 V

  • Input Voltage-Max:

    40 V

  • Input Voltage-Min:

    3.95 V

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Line Regulation-Max:

    0.03%

  • Load Regulation-Max:

    0.05%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    2

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.4 A

  • Output Voltage1-Max:

    3.37 V

  • Output Voltage1-Min:

    3.23 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SMSIP2/3H,.38,90TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    2.5 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    2.28 mm

  • Terminal Position:

    SINGLE

  • Voltage Tolerance-Max:

    2.1%

  • Width:

    6.22 mm

TLF80511TFV33ATMA1 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout in their application note AN2013-01, which includes guidelines for thermal vias, copper pours, and component placement to minimize thermal resistance.
  • Infineon recommends following the guidelines in their application note AN2013-01 for thermal design and layout, and also ensuring that the device is operated within the specified junction temperature range (TJ) of -40°C to 150°C.
  • Infineon recommends following the soldering conditions specified in their application note AN2013-01, which includes guidelines for reflow soldering, wave soldering, and hand soldering.
  • Infineon recommends following the guidelines in their application note AN2013-01 for storage and shipping, which includes guidelines for moisture sensitivity, electrostatic discharge protection, and mechanical handling.
  • Infineon recommends following the guidelines in their application note AN2013-01 for test and measurement, which includes guidelines for electrical characterization, thermal characterization, and reliability testing.

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