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TLLG5400 - Vishay

Description: Standard LEDs - Through Hole Green Tint Diffused

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PCB Footprints
TLLG5400 - Vishay PCB footprint - Other - Other - 5.8*12.5mm
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3D Models
TLLG5400 - Vishay  - 3D model - Other - 5.8*12.5mm
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TLLG5400 Details

  • Manufacturer Part Number:

    TLLG5400

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • HTS Code:

    8541.40.20.00

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Additional Feature:

    CMOS COMPATIBLE

  • Color:

    GREEN

  • Color@Wavelength:

    Green

  • Configuration:

    SINGLE

  • Forward Current-Max:

    0.007 A

  • Forward Voltage-Max:

    2.4 V

  • JESD-609 Code:

    e2

  • Lens Type:

    TINTED DIFFUSED

  • Luminous Intensity-Nom:

    1.2 mcd

  • Mounting Feature:

    RADIAL MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    SINGLE COLOR LED

  • Overall Height:

    8.7 mm

  • Packing Method:

    TR

  • Peak Wavelength:

    565 nm

  • Reverse Voltage-Max:

    6 V

  • Shape:

    ROUND

  • Size:

    5 mm

  • Surface Mount:

    NO

  • T-code:

    T-1 3/4

  • Terminal Finish:

    TIN SILVER

  • Terminal Pitch:

    2.54 mm

  • Viewing Angle:

    50 deg

TLLG5400 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a large copper area under the device, connected to a thermal pad or a heat sink, and to minimize the thermal resistance between the device and the heat sink. Additionally, using a thermal via array can help to dissipate heat more efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves for the device, ensure good thermal management, and consider using a heat sink or thermal interface material. Additionally, verifying the device's operating conditions and ensuring they are within the specified limits can help prevent thermal-related failures.
  • The TLLG5400 is not hermetically sealed, so it's essential to take precautions when using it in high-humidity environments. Moisture can affect the device's reliability and performance. Consider using conformal coating, potting, or other environmental protection methods to mitigate the effects of humidity.
  • The TLLG5400 is a surface-mount device, and its reliability in high-vibration environments depends on the quality of the solder joints and the PCB's mechanical design. Ensure that the PCB is designed to withstand vibrations, and consider using underfill or potting to enhance the device's mechanical robustness.
  • To troubleshoot issues related to the TLLG5400's thermal performance, start by verifying the device's operating conditions, including the ambient temperature, power dissipation, and thermal management. Use thermal imaging or temperature measurement tools to identify hotspots, and check for any signs of thermal damage or degradation.

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TLLG5400 Overview

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