TLP172AM(TPL,E footprint, schematic symbol and 3D model by Toshiba

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PCB Footprints

TLP172AM(TPL,E - Toshiba PCB footprint - Other - Other - 11-4M1S_H=2.3mm_1

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Datasheet Download Datasheet
Stock & Prices Price & Stock for TLP172AM(TPL,E
Part Number TLP172AM(TPL,E
Manufacturer Toshiba
Pin Count 4
Part Category Relay or Contactor
Package Category Other
Footprint Name Other - 11-4M1S_H=2.3mm_1
Released Date Aug 24, 2021
Last Modified Date Apr 4, 2025 2:48 PM UTC
Pinout / Pin List Click Here (Member Only)

TLP172AM(TPL,E Details

Manufacturer Part Number:
TLP172AM(TPL,E
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
SO-6, 4 PIN
Country Of Origin:
Thailand
HTS Code:
8541.40.95.00
Factory Lead Time:
24 Weeks
Date Of Intro:
2016-06-02
Manufacturer:
Toshiba America Electronic Components
YTEOL:
4
Additional Feature:
UL APPROVED
Configuration:
SINGLE WITH BUILT-IN DIODE
Control Current:
0.005 A
Control Voltage:
1.1 V
Forward Current-Max:
0.025 A
Input Type:
DC
Isolation Voltage-Max:
3750 V
Mounting Feature:
SURFACE MOUNT
Number of Elements:
1
On-State Current-Max:
0.325 A
On-state Resistance-Max:
2 Ω
Operating Temperature-Max:
100 °C
Operating Temperature-Min:
-20 °C
Optoelectronic Device Type:
TRANSISTOR OUTPUT SSR
Output Circuit Type:
MOSFET
Overall Height:
2.3 mm
Overall Length:
4.55 mm
Packing Method:
TR
Surface Mount:
YES

TLP172AM(TPL,E Frequently Asked Questions (FAQs)

The recommended operating voltage range for the TLP172AM is 4.5V to 5.5V.
To ensure reliability in high-temperature applications, it is recommended to follow the derating guidelines provided in the datasheet, and to consider using a heat sink or thermal management system to keep the junction temperature below 125°C.
The maximum current rating for the TLP172AM is 50mA per channel.
Yes, the TLP172AM can be used in high-frequency applications up to 100 kHz. However, it is recommended to follow the guidelines provided in the datasheet for high-frequency operation.
To protect the TLP172AM from ESD, it is recommended to follow proper handling and storage procedures, and to use ESD protection devices such as diodes or resistors in the circuit design.

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