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TLP3131(TP,F) - Toshiba

Description: MOSFET Output Optocouplers Photorelay Voff=20V Ion0.3/0.45A Ron=1Om

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PCB Footprints
TLP3131(TP,F) - Toshiba PCB footprint - Small Outline Packages - Small Outline Packages - 11-5H1
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3D Models
TLP3131(TP,F) - Toshiba  - 3D model - Small Outline Packages - 11-5H1
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TLP3131(TP,F) Details

  • Manufacturer Part Number:

    TLP3131(TP,F)

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOP-4

  • HTS Code:

    8541.40.95.00

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    0

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Control Current:

    0.01 A

  • Control Voltage:

    1 V

  • Forward Current-Max:

    0.03 A

  • Input Type:

    DC

  • Isolation Voltage-Max:

    1500 V

  • On-State Current-Max:

    0.3 A

  • On-state Resistance-Max:

    1.5 Ω

  • Operating Temperature-Max:

    60 °C

  • Operating Temperature-Min:

    25 °C

  • Output Circuit Type:

    MOSFET

  • Overall Height:

    2.1 mm

  • Overall Length:

    4.4 mm

TLP3131(TP,F) Frequently Asked Questions (FAQs)

  • Toshiba recommends a PCB layout with a solid ground plane, short traces, and minimal vias to reduce noise and ensure reliable operation. A 4-layer PCB with a dedicated power plane is also recommended.
  • The TLP3131 has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB. Ensure good thermal conductivity by using a thermal interface material and a heat sink if necessary.
  • Although the datasheet specifies a maximum VCC voltage of 5.5V, it's recommended to limit the voltage to 5V to ensure reliable operation and prevent damage to the device.
  • The TLP3131 is rated for operation up to 125°C, but its performance may degrade at high temperatures. Ensure that the device is operated within the recommended temperature range and consider using a heat sink if necessary.
  • Use a logic analyzer or oscilloscope to monitor the input and output signals. Check for proper power supply, signal integrity, and thermal management. Consult the datasheet and application notes for troubleshooting guidelines.

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