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TLP3341(TP15,F) - Toshiba

Description: MOSFET Output Optocouplers Photorelay Voff=40V Ion=0.14A Ron=10Ohm

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TLP3341(TP15,F) - Toshiba PCB footprint - Other - Other - USOP4
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TLP3341(TP15,F) - Toshiba  - 3D model - Other - USOP4
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TLP3341(TP15,F) Details

  • Manufacturer Part Number:

    TLP3341(TP15,F)

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    USOP-4

  • HTS Code:

    8541.40.95.00

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • Additional Feature:

    UL APPROVED

  • Control Current:

    0.005 A

  • Control Voltage:

    1 V

  • Forward Current-Max:

    0.02 A

  • Input Type:

    DC

  • Isolation Voltage-Max:

    500 V

  • Number of Elements:

    1

  • On-State Current-Max:

    0.14 A

  • On-state Resistance-Max:

    10 Ω

  • Operating Temperature-Max:

    65 °C

  • Operating Temperature-Min:

    -20 °C

  • Output Circuit Type:

    MOSFET

  • Overall Height:

    1.85 mm

  • Overall Length:

    2.85 mm

TLP3341(TP15,F) Frequently Asked Questions (FAQs)

  • A good PCB layout for the TLP3341 involves placing the device close to the load, using short and wide traces for the output, and separating the input and output circuits to minimize noise coupling. A solid ground plane and decoupling capacitors are also recommended.
  • To ensure proper power-on and power-off of the TLP3341, it is recommended to use a soft-start circuit to limit the inrush current, and to add a power-on reset circuit to ensure the device is fully powered on before enabling the output.
  • The TLP3341 has a thermal shutdown feature that activates when the junction temperature exceeds 150°C. To prevent overheating, ensure good airflow, use a heat sink if necessary, and avoid high ambient temperatures.
  • To protect the TLP3341 from overvoltage and undervoltage conditions, use a voltage regulator or a voltage supervisor to regulate the input voltage, and add overvoltage protection (OVP) and undervoltage protection (UVP) circuits as needed.
  • To minimize electromagnetic interference (EMI) and ensure electromagnetic compatibility (EMC), use a shielded enclosure, add EMI filters, and follow good PCB layout practices such as separating analog and digital circuits.

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