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TLRP3A30CR003FTDG - TE Connectivity

Description: Current Sense Resistors - SMD TLRP 2512 3.0W R003 1% 25PPM 2K RL

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PCB Footprints
TLRP3A30CR003FTDG - TE Connectivity PCB footprint - Resistor Chip - Resistor Chip - 2512 (6432 Metric)_2022
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3D Models
TLRP3A30CR003FTDG - TE Connectivity  - 3D model - Resistor Chip - 2512 (6432 Metric)_2022
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TLRP3A30CR003FTDG Details

  • Manufacturer Part Number:

    TLRP3A30CR003FTDG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    17 Weeks, 3 Days

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    7

  • Additional Feature:

    ANTI-SULFUR

  • Construction:

    Rectangular

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    170 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.7 mm

  • Package Length:

    6.4 mm

  • Package Style:

    SMT

  • Package Width:

    3.2 mm

  • Packing Method:

    TR, Embossed Plastic, 7 Inch

  • Rated Power Dissipation (P):

    3 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    0.003 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2512

  • Surface Mount:

    YES

  • Technology:

    METAL STRIP

  • Temperature Coefficient:

    25 ppm/°C

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    0.0949 V

TLRP3A30CR003FTDG Frequently Asked Questions (FAQs)

  • TE Connectivity provides a recommended PCB layout and land pattern in their application notes or design guides, which can be found on their website or through their customer support. It's essential to follow these guidelines to ensure proper assembly and reliability.
  • The device has a thermal pad on the bottom, which should be connected to a thermal plane on the PCB to dissipate heat efficiently. Additionally, ensure good airflow around the component and consider using thermal interface materials or heat sinks if necessary.
  • While the datasheet specifies the operating temperature range, it's essential to note that the device can tolerate short-term excursions above the maximum rated temperature. However, prolonged exposure to high temperatures can affect reliability and lifespan. Consult with TE Connectivity's application engineers for specific guidance.
  • Yes, but it's crucial to ensure the device is properly secured to the PCB using recommended mounting techniques and materials. Additionally, consider using conformal coatings or potting compounds to protect the device from environmental stresses. Consult with TE Connectivity's application engineers for specific guidance.
  • Start by reviewing the datasheet and application notes, then consult with TE Connectivity's technical support or application engineers. They can provide guidance on troubleshooting techniques, such as signal integrity analysis, power integrity analysis, and thermal imaging.

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TLRP3A30CR003FTDG Overview

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About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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Part Image LRP12FTCRR003A Viking Tech Corp

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