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TLRP3A30DR025FTE - TE Connectivity

Description: Configuration Features: Number of Resistors 1 | Dimensions: Product Length 6.4 MM | Product Length .252 INCH | Product Width 3.2 MM | Product Height .7 MM | Product Width .126 INCH | Product Height .028 INCH | Electrical Characteristics: Resistance Value .025 OHM | Passive Component Tolerance 1 PCT | Resistance Class Up to 1kΩ | Power Rating 3 WATT | Packaging Features: Packaging Method Tape & Reel | Product Type Features: Element Type Metal Strip | Package Size Code 2512 | Resistor Type Current Sensing Re

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TLRP3A30DR025FTE - TE Connectivity PCB footprint - Resistor Chip - Resistor Chip - TLRP3A30DR025FTE-
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TLRP3A30DR025FTE Details

  • Manufacturer Part Number:

    TLRP3A30DR025FTE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    17 Weeks, 3 Days

  • Manufacturer:

    TE Connectivity

  • YTEOL:

    7.45

  • Additional Feature:

    ANTI-SULFUR

  • Construction:

    Rectangular

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    170 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.7 mm

  • Package Length:

    6.4 mm

  • Package Style:

    SMT

  • Package Width:

    3.2 mm

  • Packing Method:

    TR, Embossed Plastic, 7 Inch

  • Physical Dimension:

    6.4mm x 3.2mm x .7mm

  • Rated Power Dissipation (P):

    3 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    0.025 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2512

  • Surface Mount:

    YES

  • Technology:

    METAL STRIP

  • Temperature Coefficient:

    50 ppm/°C

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    0.2739 V

TLRP3A30DR025FTE Frequently Asked Questions (FAQs)

  • TE Connectivity provides a recommended PCB layout and land pattern in their application notes or design guides, which can be found on their website or through their customer support. It's essential to follow these guidelines to ensure proper assembly and reliability.
  • The thermal management of TLRP3A30DR025FTE depends on the specific application and operating conditions. Engineers should consider the device's power dissipation, thermal resistance, and maximum junction temperature. They can use thermal simulation tools or consult with TE Connectivity's application engineers to determine the best thermal management strategy.
  • Yes, TE Connectivity provides guidelines for soldering and assembly in their application notes or datasheets. Engineers should follow these guidelines to ensure proper assembly and to prevent damage to the device. They should also consider the use of soldering profiles and thermal management techniques to minimize thermal stress.
  • TLRP3A30DR025FTE is designed to meet specific environmental and vibration standards. Engineers should consult the datasheet and application notes to determine the device's suitability for their specific application. They may also need to consider additional mechanical support or vibration damping measures to ensure the device's reliability.
  • TE Connectivity provides troubleshooting guides and application notes that can help engineers identify and resolve common issues with TLRP3A30DR025FTE. They can also consult with TE Connectivity's technical support team or use online resources and forums to find solutions to specific problems.

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TLRP3A30DR025FTE Overview

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About TE Connectivity

TE Connectivity, a global leader in connectivity and sensor solutions, designs and manufactures products that enable a more connected world. Serving a diverse range of industries, including automotive, industrial, medical, aerospace, and telecommunications, TE Connectivity offers a broad portfolio of products such as connectors, sensors, relays, and passive components. The company's innovations help improve the reliability and performance of electronic systems.

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