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TLS115D0LDXUMA1 - Infineon

Description: Linear Voltage Regulator IC Positive Adjustable 1 Output 150mA PG-TSON-10

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PCB Footprints
TLS115D0LDXUMA1 - Infineon PCB footprint - Small Outline No-lead - Small Outline No-lead - PG-TSON-10
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3D Models
TLS115D0LDXUMA1 - Infineon  - 3D model - Small Outline No-lead - PG-TSON-10
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TLS115D0LDXUMA1 Details

  • Manufacturer Part Number:

    TLS115D0LDXUMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSON-10

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    52 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6

  • Adjustability:

    ADJUSTABLE

  • Dropout Voltage1-Max:

    0.5 V

  • Dropout Voltage1-Nom:

    0.25 V

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    3.3 mm

  • Line Regulation-Max (%/V):

    0.007

  • Load Regulation-Max(%):

    0.2%

  • Moisture Sensitivity Level:

    2A

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    10

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.15 A

  • Output Voltage1-Max:

    14 V

  • Output Voltage1-Min:

    2 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HTSON

  • Package Equivalence Code:

    SOLCC8,.11,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE

  • Regulator Type:

    ADJUSTABLE POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.15 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    3.3 mm

TLS115D0LDXUMA1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Use a reliable clock source, ensure proper signal termination, and implement error detection and correction mechanisms, such as CRC and checksums, to ensure data integrity.
  • Use a shielded enclosure, ensure proper grounding, and implement EMI filters on the power supply and signal lines. Follow Infineon's guidelines for PCB layout and component placement to minimize EMI emissions.
  • Implement a power-on reset circuit with a voltage supervisor IC, and consider using a brown-out detector to ensure the device resets properly during power-up and power-down sequences.
  • Ensure good airflow around the device, use a heat sink if necessary, and consider using thermal interface materials to improve heat transfer. Monitor the device's junction temperature to prevent overheating.

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TLS115D0LDXUMA1 Overview

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