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TLS810B1LDV50XUMA1 - Infineon

Description: LDO Voltage Regulators LINEAR VOLTAGE REGULATOR

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TLS810B1LDV50XUMA1 - Infineon PCB footprint - Small Outline No-lead - Small Outline No-lead - TDSON-10
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TLS810B1LDV50XUMA1 - Infineon  - 3D model - Small Outline No-lead - TDSON-10
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TLS810B1LDV50XUMA1 Details

  • Manufacturer Part Number:

    TLS810B1LDV50XUMA1

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TSON-10

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    52 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6.2

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.55 V

  • Dropout Voltage1-Nom:

    0.55 V

  • Input Voltage Absolute-Max:

    45 V

  • Input Voltage-Max:

    42 V

  • Input Voltage-Min:

    5.55 V

  • JESD-30 Code:

    S-PDSO-N10

  • JESD-609 Code:

    e3

  • Length:

    3.3 mm

  • Line Regulation-Max:

    0.02%

  • Moisture Sensitivity Level:

    2A

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    10

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.1 A

  • Output Voltage1-Max:

    5.1 V

  • Output Voltage1-Min:

    4.9 V

  • Output Voltage1-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SON

  • Package Equivalence Code:

    SOLCC10,.13,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.15 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Voltage Tolerance-Max:

    2%

  • Width:

    3.3 mm

TLS810B1LDV50XUMA1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure the device is operated within the specified junction temperature range (TJ) of -40°C to 150°C.
  • Monitor the device's output voltage, current, and temperature. Implement over-voltage protection (OVP), under-voltage protection (UVP), and over-temperature protection (OTP) to prevent damage and ensure reliable operation.
  • Use a low-dropout regulator (LDO) or a switching regulator with a low quiescent current. Optimize the PCB layout to minimize power losses and ensure efficient power delivery.
  • Implement human body model (HBM) and charged device model (CDM) ESD protection measures, such as TVS diodes or ESD protection arrays, to prevent damage from electrostatic discharge.

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TLS810B1LDV50XUMA1 Overview

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