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TLS850B0TBV33ATMA1 - Infineon

Description: INFINEON - TLS850B0TBV33ATMA1 - LDO, AEC-Q100, FIXED, 3.3V, 0.5A, TO-263

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PCB Footprints
TLS850B0TBV33ATMA1 - Infineon PCB footprint - Other - Other - PG-TO263-5-1
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3D Models
TLS850B0TBV33ATMA1 - Infineon  - 3D model - Other - PG-TO263-5-1
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TLS850B0TBV33ATMA1 Details

  • Manufacturer Part Number:

    TLS850B0TBV33ATMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-263, 5 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    6.7

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.6 V

  • Dropout Voltage1-Nom:

    0.3 V

  • Input Voltage Absolute-Max:

    45 V

  • Input Voltage-Max:

    40 V

  • Input Voltage-Min:

    3.9 V

  • JESD-30 Code:

    R-PSSO-G5

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Line Regulation-Max:

    0.01%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.5 A

  • Output Voltage1-Max:

    3.37 V

  • Output Voltage1-Min:

    3.23 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TO-263

  • Package Equivalence Code:

    SMSIP5H,.6,67TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    4.5 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.7 mm

  • Terminal Position:

    SINGLE

  • Voltage Tolerance-Max:

    2.12%

  • Width:

    9.25 mm

TLS850B0TBV33ATMA1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to ensure efficient heat dissipation.
  • Ensure proper thermal management, use a heat sink or thermal pad, and follow the recommended PCB layout. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • The recommended soldering conditions are: peak temperature 260°C, time above 217°C 30s, and time above 200°C 60s. Use a solder with a melting point above 217°C.
  • Store the devices in their original packaging or in a dry, ESD-protected environment. Avoid exposing the devices to moisture, extreme temperatures, or physical stress.
  • The device has built-in ESD protection, but it's still recommended to follow standard ESD handling precautions, such as using an ESD wrist strap or mat, and storing the devices in ESD-protected packaging.

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TLS850B0TBV33ATMA1 Overview

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