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TLS850D0TEV33ATMA1 - Infineon

Description: LDO Voltage Regulators OPTIREG LINEAR

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TLS850D0TEV33ATMA1 - Infineon - PCB symbol
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PCB Footprints
TLS850D0TEV33ATMA1 - Infineon PCB footprint - Other - Other - PG-TO252-5-11_FFW
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TLS850D0TEV33ATMA1 - Infineon - 3D model - Other - PG-TO252-5-11_FFW
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TLS850D0TEV33ATMA1 Details

  • Manufacturer Part Number:

    TLS850D0TEV33ATMA1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TO-252 , 5 PIN

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Adjustability:

    FIXED

  • Dropout Voltage1-Max:

    0.43 V

  • Dropout Voltage1-Nom:

    0.43 V

  • Input Voltage Absolute-Max:

    45 V

  • Input Voltage-Max:

    40 V

  • Input Voltage-Min:

    3.73 V

  • JESD-30 Code:

    R-PSFM-T5

  • JESD-609 Code:

    e3

  • Line Regulation-Max:

    0.015%

  • Load Regulation-Max:

    0.005%

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    5

  • Operating Temperature TJ-Max:

    150 °C

  • Operating Temperature TJ-Min:

    -40 °C

  • Output Current1-Max:

    0.5 A

  • Output Voltage1-Max:

    3.366 V

  • Output Voltage1-Min:

    3.234 V

  • Output Voltage1-Nom:

    3.3 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SFM

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Regulator Type:

    FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

  • Screening Level:

    AEC-Q100

  • Surface Mount:

    NO

  • Terminal Finish:

    TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Voltage Tolerance-Max:

    2%

TLS850D0TEV33ATMA1 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to ensure efficient heat dissipation.
  • Ensure proper thermal management, use a heat sink or thermal pad, and follow the recommended PCB layout guidelines. Also, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • The recommended soldering conditions are: peak temperature 260°C, time above 217°C 30s, and time above 183°C 60s. Use a soldering iron with a temperature range of 350°C to 400°C.
  • Store the devices in their original packaging or in a dry, ESD-protected environment. Avoid exposing the devices to moisture, extreme temperatures, or physical stress. Use ESD-protective bags or tubes for shipping.
  • Store the devices in a dry, ESD-protected environment with a relative humidity below 60%. Avoid exposing the devices to temperatures above 40°C or below -20°C.

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TLS850D0TEV33ATMA1 Overview

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