Diptronics recommends a 2-layer PCB with a solid ground plane and thermal vias under the device. A minimum of 1 oz copper thickness is recommended. For thermal management, a heat sink with a thermal resistance of 10°C/W or lower is recommended.
Diptronics recommends following IPC-7711/7721 standards for PCB assembly and using a conformal coating to protect the device from moisture and vibration. Additionally, the device should be mounted using a secure and vibration-resistant method, such as a screw-down or adhesive mounting.
Diptronics recommends derating the power by 1.5% per degree Celsius above 85°C. For example, at 100°C, the power should be derated by 22.5% (1.5% x 15°C).
Yes, the TMG-325R-V-T/R can be used in a parallel configuration to increase power output. However, Diptronics recommends using a current-sharing scheme, such as a resistive divider network, to ensure equal current distribution between devices.
Diptronics recommends using a human-body model (HBM) ESD protection device with a minimum rating of 2 kV. The ESD protection device should be placed as close as possible to the TMG-325R-V-T/R.
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TMG-325R-V-T/R Overview
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