TMG25CQ60F footprint, schematic symbol and 3D model by SanRex

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TMG25CQ60F Details

A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Implement a thermal management system, such as a heat sink or fan, to maintain a safe operating temperature.
The maximum allowable voltage transient is 80V for a duration of ≤ 100ns. Exceeding this may cause damage to the device.
Yes, the TMG25CQ60F is designed for high-reliability applications. It has undergone rigorous testing and meets the requirements of AEC-Q101, ensuring its suitability for automotive and other high-reliability applications.
Handle the device with ESD-protective equipment and follow proper ESD-handling procedures. Ensure that the device is stored in an ESD-protective package when not in use.

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