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TMM2016BP-12 - Toshiba

Description: (TMM2016BP Series) 2K x 8 Bit Static RAM

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PCB Footprints
TMM2016BP-12 - Toshiba PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - TC5516APL/-2
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TMM2016BP-12 - Toshiba  - 3D model - Dual-In-Line Packages - TC5516APL/-2
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TMM2016BP-12 Details

  • Manufacturer Part Number:

    TMM2016BP-12

  • Part Life Cycle Code:

    Active

  • Package Description:

    DIP-24

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.41

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    3

  • Access Time-Max:

    12 ns

  • Additional Feature:

    LG-MAX

  • I/O Type:

    COMMON

  • JESD-30 Code:

    R-PDIP-T24

  • JESD-609 Code:

    e0

  • Length:

    32.4 mm

  • Memory Density:

    16384 bit

  • Memory IC Type:

    STANDARD SRAM

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    24

  • Number of Words:

    2048 words

  • Number of Words Code:

    2000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    70 °C

  • Organization:

    2KX8

  • Output Characteristics:

    3-STATE

  • Output Enable:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP24,.6

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Parallel/Serial:

    PARALLEL

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5 mm

  • Standby Current-Max:

    0.005 A

  • Standby Voltage-Min:

    4.5 V

  • Supply Current-Max:

    0.05 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    MOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    15.24 mm

TMM2016BP-12 Frequently Asked Questions (FAQs)

  • Toshiba recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently.
  • To ensure reliable operation, follow the recommended derating curves for temperature and current, and consider using a heat sink or thermal interface material to reduce junction temperature.
  • The maximum allowable voltage for the TMM2016BP-12 is 120% of the rated voltage (12V) for a short duration (less than 100ms), but it's recommended to operate within the rated voltage to ensure reliability.
  • Yes, the TMM2016BP-12 is suitable for high-frequency switching applications up to 100kHz, but be aware of the increased power losses and consider using a snubber circuit to reduce ringing.
  • To minimize power dissipation during idle mode, consider using a low-power mode or shutdown feature, and ensure that the input voltage is reduced or removed to minimize standby power consumption.

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TMM2016BP-12 Overview

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Part Image 8403615JA LOGIC Devices Inc

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For a full list of alternate parts for TMM2016BP-12, check out Findchips.com