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TMP01ESZ-REEL - Analog Devices

Description: Board Mount Temperature Sensors Lo Pwr Prog Cntlr SGL Supply 4.5-13.2V

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TMP01ESZ-REEL - Analog Devices PCB footprint - Small Outline Packages - Small Outline Packages - R-8 (SOIC)
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TMP01ESZ-REEL - Analog Devices  - 3D model - Small Outline Packages - R-8 (SOIC)
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TMP01ESZ-REEL Details

  • Manufacturer Part Number:

    TMP01ESZ-REEL

  • Brand Name:

    Analog Devices Inc

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOIC-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    R-8

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    10

  • Accuracy-Max (Cel):

    3 Cel

  • Additional Feature:

    TTL COMPATIBLE, CMOS COMPATIBLE

  • Body Breadth:

    3.9 mm

  • Body Height:

    1.55 mm

  • Body Length or Diameter:

    4.9 mm

  • Housing:

    PLASTIC

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    8

  • Operating Current-Max:

    0.8 mA

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Interface Type:

    0.5

  • Output Voltage-Max:

    2.51 V

  • Output Voltage-Min:

    2.49 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape/Style:

    RECTANGULAR

  • Sensors/Transducers Type:

    TEMPERATURE SENSOR,ANALOG,VOLTAGE OUTPUT

  • Supply Voltage-Max:

    13.2 V

  • Supply Voltage-Min:

    4.5 V

  • Surface Mount:

    YES

  • Technology:

    HYBRID

  • Terminal Finish:

    Matte Tin (Sn)

  • Termination Type:

    SOLDER

TMP01ESZ-REEL Frequently Asked Questions (FAQs)

  • A good PCB layout for the TMP01ESZ-REEL involves placing the device near the thermal source, using a solid copper plane for heat spreading, and minimizing thermal barriers such as vias and solder resist.
  • Calibration involves applying a known temperature to the device and measuring the output voltage. The device can be calibrated using a two-point calibration method, where the output voltage is measured at two known temperatures (e.g., 0°C and 100°C).
  • The recommended power-up sequence is to apply VCC first, followed by a delay of at least 10 ms, and then apply the input voltage to the VIN pin. This ensures proper device initialization and prevents latch-up.
  • To minimize EMI, use a shielded cable for the output signal, keep the device away from high-frequency sources, and use a low-pass filter to attenuate high-frequency noise.
  • The maximum cable length depends on the output signal frequency and the noise environment. As a general guideline, keep the cable length below 10 meters to minimize signal degradation and noise pickup.

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TMP01ESZ-REEL Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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