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TMS322512ALM-1R0MTAA - TDK

Description: Thin-film 1μH 20% 37mohm 5.1A

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PCB Footprints
TMS322512ALM-1R0MTAA - TDK PCB footprint - Inductors Chip - Inductors Chip - 3225
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3D Models
TMS322512ALM-1R0MTAA - TDK  - 3D model - Inductors Chip - 3225
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TMS322512ALM-1R0MTAA Details

  • Manufacturer Part Number:

    TMS322512ALM-1R0MTAA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    7.4

  • Case/Size Code:

    1210

  • Construction:

    Rectangular

  • Core Material:

    Metal

  • DC Resistance:

    0.037 Ω

  • Inductance-Nom (L):

    1 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    1.2 mm

  • Package Length:

    3.2 mm

  • Package Style:

    SMT

  • Package Width:

    2.5 mm

  • Packing Method:

    TR, Embossed Plastic, 7 Inch

  • Rated Current-Max:

    4 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

TMS322512ALM-1R0MTAA Frequently Asked Questions (FAQs)

  • The recommended land pattern for the TMS322512ALM-1R0MTAA can be found in the TDK Corporation's application note or footprint library. It's essential to follow the recommended land pattern to ensure proper soldering and to prevent thermal and electrical issues.
  • To prevent damage, handle the TMS322512ALM-1R0MTAA by the edges, avoid touching the pins or the component body, and use an anti-static wrist strap or mat. Also, ensure that the assembly area is clean and free from debris.
  • The thermal management strategy for the TMS322512ALM-1R0MTAA involves providing a thermal path from the component to a heat sink or a metal core PCB. This can be achieved using thermal interface materials, thermal vias, or a metal heat spreader. The goal is to keep the component's junction temperature below the maximum rated temperature.
  • The TMS322512ALM-1R0MTAA is designed to withstand certain levels of vibration, but it's essential to evaluate the component's vibration tolerance based on the specific application requirements. TDK Corporation may provide additional information on vibration testing and reliability in their application notes or technical support resources.
  • To troubleshoot issues related to the TMS322512ALM-1R0MTAA, start by checking the component's datasheet and application notes for guidance. Then, use standard debugging techniques such as visual inspection, signal probing, and power supply analysis. If the issue persists, contact TDK Corporation's technical support for further assistance.

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TMS322512ALM-1R0MTAA Overview

Use the download button to access the TMS322512ALM-1R0MTAA schematic symbol, PCB footprint, and 3D model.
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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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