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TN1205H-6T - STMicroelectronics

Description: SCRs High Temp 12A SCR 600V 2 to 5 mA IGT

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TN1205H-6T - STMicroelectronics - PCB symbol
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TN1205H-6T - STMicroelectronics PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TN1205H-6T
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TN1205H-6T - STMicroelectronics - 3D model - Transistor Outline, Vertical - TN1205H-6T
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TN1205H-6T Details

  • Manufacturer Part Number:

    TN1205H-6T

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220AB

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    6.43

  • Case Connection:

    ANODE

  • Circuit Commutated Turn-off Time-Nom:

    65 µs

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Off-State Voltage-Min:

    100 V/us

  • DC Gate Trigger Current-Max:

    5 mA

  • DC Gate Trigger Voltage-Max:

    1.3 V

  • Holding Current-Max:

    20 mA

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    3 mA

  • Non-Repetitive Pk On-state Cur:

    126 A

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • On-state Current-Max:

    12000 A

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • RMS On-state Current-Max:

    12 A

  • Repetitive Peak Off-state Voltage:

    600 V

  • Repetitive Peak Reverse Voltage:

    600 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Trigger Device Type:

    SCR

TN1205H-6T Frequently Asked Questions (FAQs)

  • A good PCB layout for the TN1205H-6T should include a solid ground plane, wide traces for power and ground, and a thermal relief pattern under the package to facilitate heat dissipation. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate airflow, using a heat sink, and ensuring good thermal interface material (TIM) between the device and heat sink. Additionally, consider derating the device's power handling capabilities according to the temperature derating curve provided in the datasheet.
  • To ensure EMI and EMC compliance, it's crucial to follow proper PCB layout practices, such as separating analog and digital circuits, using shielding, and implementing filtering and decoupling techniques. Additionally, consider using a common-mode choke and ferrite beads to reduce electromagnetic interference.
  • To protect the TN1205H-6T from overvoltage and overcurrent conditions, consider using a voltage regulator with overvoltage protection (OVP) and overcurrent protection (OCP) features. Additionally, use a fuse or a polyfuse to limit the current in case of a fault condition.
  • To prevent damage and ensure reliability, store the TN1205H-6T in a dry, cool place, away from direct sunlight and moisture. Handle the device by the body, avoiding touching the pins or leads. Use anti-static wrist straps and mats when handling the device to prevent electrostatic discharge (ESD) damage.

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TN1205H-6T Overview

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To find more CAD model downloads similar to this part, try a partial part number search, like TN120, or try a keyword search, such as Silicon Controlled Rectifiers

About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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